Study on stress evolution in the cooling process of micro hot embossing
Crossref DOI link: https://doi.org/10.1186/s40712-014-0020-9
Published Online: 2014-11-11
Published Print: 2014-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gomez, Juan A
Lek, Devanda
Song, In-Hyouk
You, Byoung Hee
License valid from 2014-11-11
Article History
Received: 5 May 2014
Accepted: 26 September 2014
First Online: 11 November 2014