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Thermally Conductive Excipient Expands KinetiSol® Processing Capabilities

Crossref DOI link: https://doi.org/10.1208/s12249-020-01817-7

Published Online: 2020-11-11

Published Print: 2020-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Davis, Daniel A. Jr

Miller, Dave A.

Su, Yongchao

Williams, Robert O. III https://orcid.org/0000-0003-4993-6427
License Information

Text and Data Mining valid from 2020-11-01

Version of Record valid from 2020-11-01
More Information

Article History

Received: 7 June 2020

Accepted: 8 September 2020

First Online: 11 November 2020