Key factors in the physical design of high-performance chips
Crossref DOI link: https://doi.org/10.1360/SSI-2023-0330
Published Online: 2024-01-04
Published Print: 2024-01-01
Update policy: https://doi.org/10.1360/scp-crossmark-policy-page
FAN, Lingyan
HUANG, Cankun
ZHU, Zhiwei
LIU, Hailuan
MA, Xiangyuan