Formation of wavy crack morphology in silicon oxide films due to collaborative interface debonding
Crossref DOI link: https://doi.org/10.1360/SSPMA2018-00160
Published Online: 2018-08-09
Published Print: 2018-09-01
Update policy: https://doi.org/10.1360/scp-crossmark-policy-page
CHENG, Fu
MA, Long
NI, Yong
