Planarized Copper Multilevel Interconnections for ULSI Applications
Crossref DOI link: https://doi.org/10.1557/S088376940004776X
Published Online: 2013-11-29
Published Print: 1994-08
Update policy: https://doi.org/10.1017/policypage
Misawa, N.
Ohba, T.
Yagi, H.
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License: Copyright © Materials Research Society 1994