Hybrid cured thiol-ene/epoxy networks for core-shell semiconductor packaging
Crossref DOI link: https://doi.org/10.1557/adv.2016.59
Published Online: 2016-01-26
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Maaraoui, Kayla V.
Ellson, Gregory
Voit, Walter
Text and Data Mining valid from 2016-01-01
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Article History
First Online: 26 January 2016