Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration
Crossref DOI link: https://doi.org/10.1557/jmr.2016.145
Published Online: 2016-04-15
Published Print: 2016-06-28
Update policy: https://doi.org/10.1017/policypage
Guo, Fu
Liu, Qian
Ma, Limin
Zuo, Yong http://orcid.org/0000-0002-2929-9806
Funding for this research was provided by:
Beijing Nova Program (xx2016118)
License valid from 2016-04-15
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License: Copyright © Materials Research Society 2016