Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue
Crossref DOI link: https://doi.org/10.1557/jmr.2017.199
Published Online: 2017-06-13
Published Print: 2017-06-14
Update policy: https://doi.org/10.1017/policypage
Bigl, Stephan http://orcid.org/0000-0001-7035-6772
Trost, Claus O.W.
Wurster, Stefan
Cordill, Megan J.
Kiener, Daniel
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License: Copyright © Materials Research Society 2017