Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress
Crossref DOI link: https://doi.org/10.1557/jmr.2019.201
Published Online: 2019-07-16
Published Print: 2019-08-28
Update policy: https://doi.org/10.1017/policypage
Liang, Shui-Bao
Ke, Chang-Bo
Wei, Cheng
Huang, Jia-Qiang
Zhou, Min-Bo
Zhang, Xin-Ping
License valid from 2019-07-16
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License: Copyright © Materials Research Society 2019