Microstructure and mechanical property of Cu/In–45Cu/Ni solder joints formed by transient liquid phase bonding
Crossref DOI link: https://doi.org/10.1557/jmr.2020.194
Published Online: 2020-08-13
Published Print: 2020-11-16
Update policy: https://doi.org/10.1017/policypage
Yang, Li
Zhou, Shiyuan
Zhang, Yaocheng
Xiong, Yifeng
Jiang, Wei
Shen, Sai
License valid from 2020-08-13
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Copyright: Copyright © The Author(s), 2020, published on behalf of Materials Research Society by Cambridge University Press