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Programmable microscale stiffness pattern of flat polymeric substrates by temperature-memory technology

Published Online: 2019-03-15

Published Print: 2019-03

Authors

Jiang, Yi

Mansfeld, Ulrich

Kratz, Karl

Lendlein, Andreas
Funding

Funding for this research was provided by:

Bundesministerium für Bildung und Forschung (031A095)

Helmholtz-Gemeinschaft (programme-oriented funding)
License Information

Text and Data Mining valid from 2019-03-01

Version of Record valid from 2019-03-15
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Article History

Received: 10 January 2019

Accepted: 12 January 2019

First Online: 15 March 2019

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