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Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application

Crossref DOI link: https://doi.org/10.1557/s43578-024-01436-z

Published Online: 2024-09-12

Published Print: 2024-11-15

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Tripathi, Vivek Mani

Sharma, Pawan https://orcid.org/0000-0002-3374-9937
Tyagi, Rajnesh
Funding

Funding for this research was provided by:

Science and Engineering Research Board (CRG/2023/003836)
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Text and Data Mining valid from 2024-09-12

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Article History

Received: 13 June 2024

Accepted: 29 August 2024

First Online: 12 September 2024

Declarations

:

: There is no conflict of interest by any author.

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