Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding
Crossref DOI link: https://doi.org/10.1557/jmr.2017.171
Published Online: 2017-05-15
Published Print: 2017-08
Update policy: https://doi.org/10.1017/policypage
Zhong, Yi
Zhao, Ning
Dong, Wei
Ma, Haitao
Huang, Mingliang
Yin, Luqiao
Wong, Chingping
Copyright and Licensing
License: Copyright © Materials Research Society 2017