Effects of an interfacial layer on stress relaxation mechanisms active in the Cu-Si thin film system during thermal cycling
Crossref DOI link: https://doi.org/10.1557/mrc.2020.6
Published Online: 2020-09-20
Published Print: 2020-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Somaiah, Nalla
Kanjilal, Anwesha
Kumar, Praveen
Text and Data Mining valid from 2020-03-01
Version of Record valid from 2020-03-01
Article History
Received: 4 December 2019
Accepted: 2 January 2020
First Online: 20 September 2020