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Paper Title: Curing parameter optimization of the adhesive film in honeycomb sandwich structures through mechanical performance
Journal Title: International Journal of Advanced and Applied Sciences
CrossRef DOI link to publisher maintained version: https://doi.org/10.21833/ijaas.2019.06.009
Content Type: Article
Copyright: © 2019 The Authors. Published by IASE. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).