Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature
Crossref DOI link: https://doi.org/10.2478/s13536-013-0182-9
Published Online: 2014-07-22
Published Print: 2014-06-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Nowak, Damian
Stafiniak, Andrzej
Dziedzic, Andrzej
License valid from 2014-06-01
Text and Data Mining valid from 2014-06-01
