Crossmark

Effect of Aging Temperature on the Microstructure and Shear Strength of SAC0307-0.1Ni Lead-Free Solders in Copper Joints

Published Online: 2020-03-29

Published Print: 2020-01

Authors

Phairote Sungkhaphaitoon,

Suchart Chantaramanee,
License Information

Text and Data Mining valid from 2020-01-01

Version of Record valid from 2020-01-01
More Information

Article History

Received: 4 February 2019

Revised: 10 June 2019

Accepted: 13 June 2019

First Online: 29 March 2020

CONFLICT OF INTEREST

: The authors claim that they have no conflict of interest.

Document is current