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A Thermal Model of an IGBT Module Taking into Account Thermal Interconnections between Chips

Published Online: 2019-05-13

Published Print: 2019-01

Authors

Ilyin, M. V.

Vilkov, E. A.

Gulyaev, I. V.
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Text and Data Mining valid from 2019-01-01

Version of Record valid from 2019-01-01
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Article History

Received: 3 October 2018

Revised: 4 October 2018

Accepted: 4 October 2018

First Online: 13 May 2019

Document is current