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Modeling of Thermal Processes in “Package-on-Package” Type Multichip Microcircuits

Published Online: 2021-09-21

Published Print: 2021-07

Authors

Belyaev, M. A.

Putrolainen, V. V.

Seredov, P. N.

Lunkov, P. V.
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Text and Data Mining valid from 2021-07-01

Version of Record valid from 2021-07-01
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Article History

Received: 10 June 2020

Revised: 29 September 2020

Accepted: 8 October 2020

First Online: 21 September 2021

Document is current