CFD Simulation on IC Thermal Cooling through Water Involved TiO2, AlN and CuO Nanofluids
Crossref DOI link: https://doi.org/10.35940/ijitee.J9288.0881019
Published Online: 2019-08-30
Update policy: https://doi.org/10.35940/beiesp.crossmarkpolicy
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Kund, N. K.
