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Wafer-level fabrication of a high-silica v-groove for fiber-optic packaging using deep dry-etching with a dual-frequency high-density plasma

Crossref DOI link: https://doi.org/10.3938/jkps.67.1179

Published Online: 2015-12-03

Published Print: 2015-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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