Effect of bias voltage on the microstructure and hardness of Ti-Si-N films deposited by using high-power impulse magnetron sputtering
Crossref DOI link: https://doi.org/10.3938/jkps.68.351
Published Online: 2016-02-02
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ding, JiCheng
Zou, ChangWei
Wang, QiMin
Zeng, Kun
Feng, SiCheng
Text and Data Mining valid from 2016-01-01