Adhesion and failure analysis of metal-polymer interface in flexible printed circuits boards
Crossref DOI link: https://doi.org/10.3938/jkps.71.1019
Published Online: 2017-07-18
Published Print: 2017-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Sanghee
Kim, Ye Chan
Choi, Kisuk
Chae, Heeyop
Suhr, Jonghwan
Nam, Jae-Do
License valid from 2017-07-18