Plasma Etching of Silicon at a High Flow and a High Pressure of NF3 in Reactive Ion Etching
Crossref DOI link: https://doi.org/10.3938/jkps.74.1135
Published Online: 2019-06-26
Published Print: 2019-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kwon, Hee-Tae
Kim, Woo-Jae
Shin, Gi-Won
Lee, Hwan-Hee
Lee, Tae-Hyun
Kang, Min-Ho
Kwon, Gi-Chung
Text and Data Mining valid from 2019-06-01
Version of Record valid from 2019-06-01
Article History
Received: 14 January 2019
Revised: 1 April 2019
First Online: 26 June 2019