First Wafer Effect of Multiple SiO2/SiN Stack Layers Prepared by using Plasma-enhanced Chemical Vapor Deposition
Crossref DOI link: https://doi.org/10.3938/jkps.76.911
Published Online: 2020-05-29
Published Print: 2020-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Min Su
Kwon, Hojoong
Kim, Hyoyoung
Park, Seung-ho
Lee, Jeong Woo
Na, Kyung Pil
Kong, Chul Min
Kim, Yong Gab
Text and Data Mining valid from 2020-05-01
Version of Record valid from 2020-05-01
Article History
Received: 27 February 2020
Revised: 17 March 2020
Accepted: 17 March 2020
First Online: 29 May 2020