Low-temperature, rapid thermal annealing of CIS thin films deposited by using a co-sputtering process with in and CuSe2 targets
Crossref DOI link: https://doi.org/10.3938/jkps.66.1001
Published Online: 2015-04-16
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Nam-Hoon
Sung, Back-Sub
Jun, Young-Kil
Chung, Dong Hyun
Lee, Woo-Sun
Text and Data Mining valid from 2015-03-01