Characteristics of a nickel thin film and formation of nickel silicide by using remote plasma atomic layer deposition with Ni( i Pr-DAD)2
Crossref DOI link: https://doi.org/10.3938/jkps.66.821
Published Online: 2015-03-21
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Jinho
Jang, Woochool
Park, Jingyu
Jeon, Heeyoung
Kim, Hyunjung
Yuh, Junhan
Jeon, Hyeongtag
Text and Data Mining valid from 2015-03-01